Temperature control component for electronic systems

ABSTRACT

A temperature control component includes a TEC that includes a top surface and a bottom surface. A thermal conduction layer includes a top surface and a bottom surface. The top surface of the thermal conduction layer is coupled to the bottom surface of the TEC. The bottom surface of the thermal conduction layer includes a planar area. The planar area of the thermal conduction layer is to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer the thermal energy at the two or more electronic devices.

TECHNICAL FIELD

The present disclosure generally relates to a temperature controlcomponent, and more specifically, relates to a temperature controlcomponent for electronic systems.

BACKGROUND

A memory sub-system can include one or more memory components that storedata. The memory components can be, for example, non-volatile memorycomponents and volatile memory components. In general, a host system canutilize a memory sub-system to store data at the memory components andto retrieve data from the memory components.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will be understood more fully from the detaileddescription given below and from the accompanying drawings of variousimplementations of the disclosure. The drawings, however, should not betaken to limit the disclosure to the specific embodiments, but are forexplanation and understanding only.

FIG. 1 illustrates an example environment to allocate test resources toperform a test of electronic devices, such as memory components, inaccordance with some embodiments of the disclosure.

FIG. 2A illustrates a temperature control component in a collapsed view,in accordance with some embodiments of the disclosure.

FIG. 2B illustrates a temperature control component in an expanded view,in accordance with some embodiments of the disclosure.

FIG. 2C illustrates an alternative temperature control component in acollapsed view, in accordance with some embodiments of the disclosure.

FIG. 2D illustrates another alternative temperature control component ina collapsed view, in accordance with some embodiments of the disclosure.

FIG. 3A illustrates a thermal chamber in a closed position, inaccordance with embodiments of the disclosure.

FIG. 3B illustrates a thermal chamber in an open position, in accordancewith embodiments of the disclosure.

FIG. 4A illustrates a thermal testing system in an expanded view, inaccordance with embodiments of the disclosure.

FIG. 4B illustrates a thermal testing system in a collapsed view, inaccordance with embodiments of the disclosure.

FIG. 5 is a block diagram of an example computer system in whichimplementations of the present disclosure can operate.

DETAILED DESCRIPTION

Aspects of the present disclosure are directed to a temperature controlcomponent for use with electronic systems. In a conventional thermaltest process, electronic devices can be placed into a chamber (i.e., anoven) that tests the electronic devices under various temperatureconditions. For example, a single chamber can be used to test componentsof multiple memory subsystems at a single time at a particulartemperature. Hot or cold gas can be pumped into the chamber to controlthe temperature of the chamber and the temperature of the electronicdevices therein. The test process can instruct various operations to beperformed at the electronic devices at the particular temperature. Suchoperations can include, but are not limited to, read operations, writeoperations, or erase operations. The performance and behavior of theelectronic devices can be observed or measured while the test process isperformed. For example, performance characteristics (e.g., read or writelatencies) and reliability of data stored at the memory components canbe measured and recorded during the test process. However, since thechamber can only apply a single temperature to all the electronicdevices at any particular time, the testing of the electronic devices atmany different temperatures can require a large amount of time as thetest process will need to be performed for each desired temperature.Moreover, all the components of a system within the chamber arecontrolled to the same temperature, and in some instances it is desiredto test only a subset of the components of a system at a certaintemperature. Additionally, the chamber can only perform a single testprocess at a time. As such, performing different tests on the electronicdevices at different operating conditions (e.g., different temperatures)can utilize a large amount of time if many different conditions of thetest process for the electronic devices are desired.

A thermoelectric component (TEC) (also referred to as a “thermoelectriccooler”) can transduce electrical energy into thermal energy, and viceversa. A TEC can include two surfaces. When a voltage potential isapplied to the TEC one surface heats while the other surfaceconcurrently cools. In some conventional systems, a thermoelectriccomponent can be directly applied to an object, such as one or moreelectronic devices of an electronic system, to change the temperature ofthe object. However, in some instances the TEC is shaped in a mannerthat is not conducive to transferring thermal energy to the one or moreelectronic devices. Additionally, in some instances applying a singleTEC to an electrical device does not transfer enough thermal energy tomeet the temperature testing range of some thermal testing conditions.Moreover, an electronic system can include multiple electronic devicesthat are coupled to a circuit board. The multiple electronic devices canhave different vertical heights. Using one or more planar TECs tocontact all or a desired subset of the electronic devices may not befeasible.

In some conventional systems, to address the removal of excess heat, twoTECs with varying sizes can be stacked directly upon one another. Inaddition to the above stated challenges, stacking two TECs on top of oneanother can be highly inefficient and is often not sufficient intransferring enough thermal energy to meet the temperature testingranges for electrical devices.

Aspects of the disclosure address the above and other challenges byproviding a temperature control component that implements one or moreTECs that are coupled to a thermal conduction layer. The thermalconduction layer includes a bottom surface that includes a planar area.The planar area of the thermal conduction layer can be positioned aboveone or more electronic devices of an electronic system to transferthermal energy to the one or more electronic devices.

In some embodiments, the bottom surface of the thermal conduction layerincludes one or more notched areas. The planar area is intersected bythe notched area. The notched area includes a void or air gap such thatthe notched area does not thermally couple to the electronic devicesdirectly under the notched area. The planar area and the notched area ofthe bottom surface of the thermal conduction layer can allow thetemperature control component to transfer thermal energy to some of theelectronic devices of the electronic system and insulate otherelectronic devices of the electronic system from the transfer of thermalenergy.

In some embodiments, the planar area of the thermal conduction layer canbe coupled to a thermal pad. In some embodiments, the thermal pad iscompressible and thermally conductive. The thermal pad can allow thetemperature control component, and specifically the planar area of thethermal conduction layer to thermally couple to electronic devices thathave varying vertical heights.

In some embodiments, the temperature control component includes an upperTEC that includes a top surface and a bottom surface. The temperaturecontrol component also includes a thermal transfer component thatincludes a top surface and a bottom surface. The bottom surface of theupper TEC is coupled to the top surface of the thermal transfercomponent. The temperature control component includes a lower TEC. Thetop surface of the lower TEC is coupled to the bottom surface of thethermal transfer component. The temperature control component includes athermal conduction layer with a top surface and a bottom surface. Thetop surface of the thermal conduction layer is coupled to the bottomsurface of the lower TEC. The bottom surface of the thermal conductionlayer includes a planar area that is to be positioned above two or moreelectronic devices of an electronic system to transfer thermal energy atthe electronic devices.

Advantages of the present disclosure include, but are not limited to,providing a temperature control component that allows for efficientthermal energy transfer between the temperature control component andone or more electronic devices of an electronic system. Moreover,multiple temperature control components can be implemented toindependently control thermal conditions at respective electronicsystems, which allows for more efficient electronic device testing underdifferent thermal conditions. Additionally, aspects of the presentdisclosure can apply thermal conditions in a temperature range that isbroader and lower than conventional testing systems. Many differenttests of the electrical devices can be performed more quickly and thereliability of the electrical devices can also be improved as anypotential defects or flaws can be identified and later addressed in thedesign or manufacturing of the electrical devices.

FIG. 1 illustrates an example environment to allocate test resources toperform a test of electronic devices, such as memory components, inaccordance with some embodiments of the disclosure. A test platform 100can include one or more racks 110A, 110B, and 110N. Each of the racks110A, 110B, and 110N can include multiple frames 120 where each frame120 includes one or more thermal chambers. The test platform 100 caninclude any number of racks or thermal chambers.

In some embodiments, a thermal chamber can enclose an electronic systemwithin the chamber of the thermal chamber. The electronic system canhave one or more electronic devices. In some embodiments, multipleelectronic devices are coupled to a circuit board to form the electronicsystem. In some embodiments, the electronic device can be a discretecomponent that is encased in a package (e.g., ceramic packagingmaterial). The package material can have pins, solder bumps, orterminals external to the package that connect on-chip or on-dieelements to off-chip or off-die elements (e.g., a power supply, othercomponents at the circuit board, etc.).

As shown, a frame 120 can include one or more thermal chambers. Forexample, a frame 120 can include a first thermal chamber 121, a secondthermal chamber 122, and a third thermal chamber 123. Although threethermal chambers are shown, a frame 120 can include any number ofthermal chambers. Additionally, each thermal chamber can be fitted witha temperature control component that is used to apply a temperaturecondition to one or more of the electronic devices of the electronicsystem. For example, the temperature control component can thermallycouple with the packages of electronic devices of a memory sub-system toadjust the package temperatures or on-die temperatures to a desiredtemperature value in a temperature range. In some embodiments, thetemperature control component can be used to apply a temperature localto a respective electronic devices of a particular electronic systemthat is different than a temperature that is applied by anothertemperature control component to other respective electronic devices ofanother electronic system at the same or different frame 120. Forexample, a first temperature control component can apply a temperatureof −20 degrees Celsius to the electronic devices of the a particularmemory sub-system, and another temperature control component locatedadjacent to the first temperature control component can apply atemperature of 100 degrees Celsius to other electronic devices ofanother memory sub-system that is located at the same frame 120.

In some embodiments, the temperature control component can include oneor more thermoelectric components (TEC). In some embodiment, thetemperature control component that includes one or more TECs can utilizea Peltier effect to apply a heating or cooling effect to electronicdevices of an electronic system that is coupled to the temperaturecontrol component. For example, a bottom part of the temperature controlcomponent can couple to the packages of the electronic devices of theelectronics system to transfer thermal energy to and from the electronicdevices. In some embodiments, the thermoelectric component can be aPeltier device. In some embodiments, the thermoelectric component caninclude an array of alternating n-type and p-type semiconductorsdisposed between two plates, such as two ceramic plates. A voltageapplied to the thermoelectric component causes one plate to cool whileanother plate heats.

As shown, each test rack 110A, 110B, and 110N can include multipleframes 120. Each of the frames 120 of a particular test rack can becoupled with a local test component. For example, each test rack 110A,110B, and 110N can respectively include a local test component 111A,111B, and 111N. Each of the local test components 111A, 111B, and 111Ncan receive instructions to perform a test or a portion of a test thatis to be performed at the thermal chambers of the respective test rack.For example, a resource allocator component 130 can receive (e.g., froma user) conditions of the test that is to be performed and the resourceallocator component 130 can determine particular thermal chambers acrossthe different frames 120 at one or more of the test racks 110A, 110B,and 110N that can be used by the test. In some embodiments, the resourceallocator component 130 can be provided by a server 131. In someembodiments, the server 131 is a computing device or system that iscoupled with the local test components 111A, 111B, and 111N over anetwork.

The temperate control component of each thermal chamber 121, 122, and123 of each frame 120 can be used to apply a different temperaturecondition to electronic devices of the respective electronic system.Furthermore, a communication channel can be formed between eachelectronic system at each thermal chamber and server 131. For example,server 131 can control each electronic system such that each electronicsystem performs different operations under different thermal conditions.

The resource allocator component 130 can receive a test input from auser. The test input can specify conditions of the test that is to beperformed with one or more electronic systems. For example, the test canspecify particular temperature conditions that are to be applied tomemory components of a memory sub-system and a sequence of operationsthat are to be performed at memory components under particulartemperature conditions. The resource allocator 130 can retrieve a datastructure that identifies available thermal chambers across the testplatform 100 as well as characteristics of the available thermalchambers and the electronic systems therein. Subsequently, the resourceallocator component 130 can assign thermal chambers at the test platform100 that include electronic devices (e.g., embedded memory components)that match or satisfy the conditions of the test. The resource allocatorcomponent 130 can then transmit instructions to local test components oftest racks that include thermal chambers that are to be used in thetest.

In some embodiments, a thermal chamber can include one or more ports.The one or more ports can expose a chamber within the thermal chamber.The electronic devices of the electronic system are accessible from theone or more ports. In some embodiments, the one or more ports areconfigured to receive a temperature control component. In someembodiments, the bottom part of the temperature control componentextends within the chamber of the thermal chamber and couples torespective electronic devices. The top part of the temperature controlcomponent, such a heat sink, can extend above the thermal chamber. Insome embodiments, the temperature control component can be coupled tothe thermal chamber. In some embodiments, the thermal chamber can beused to hold the temperature control component in place. In someembodiments, the thermal chamber can align the temperature controlcomponent with the respective electronic devices so that the bottom partof the temperature control component can couple with the respectiveelectronic devices. The multiple temperature control components canconcurrently apply different temperatures to the electronic systemswithin a thermal chamber. A thermal chamber is further described belowat least with respect to FIG. 3A-3B and FIG. 4A-4B.

FIGS. 2A-2D illustrate a temperature control component, in accordancewith some embodiments of the disclosure. FIG. 2A illustrates atemperature control component in a collapsed view, in accordance withsome embodiments of the disclosure. FIG. 2B illustrates a temperaturecontrol component in an expanded view, in accordance with someembodiments of the disclosure. FIG. 2C illustrates an alternativetemperature control component in a collapsed view, in accordance withsome embodiments of the disclosure. FIG. 2D illustrates anotheralternative temperature control component in a collapsed view, inaccordance with some embodiments of the disclosure. Temperature controlcomponent 200 is illustrated with a number of elements for purposes ofillustration, rather than limitation. In other embodiments, temperaturecontrol component 200 can include the same, different, fewer, oradditional elements. Temperature control component 200 is illustratedwith relative positional relationships, such as top, bottom, front, andend, for purposes of illustration rather than limitation. It can benoted that assigning other positional relationships to temperaturecontrol component 200 and the elements of the temperature controlcomponent 200 is within the scope of the disclosure.

A thermoelectric component (TEC) (also referred to as a “thermoelectriccooler”) can transduce electrical energy into thermal energy, and viceversa. A TEC can include two surfaces. When a voltage potential isapplied to the TEC one surface heats while the other opposing surfaceconcurrently cools. A TEC can generate more thermal energy at onesurface than the TEC dissipates at an opposing surface. For example, forevery 1 degree Celsius reduction at a first surface of a TEC, theopposing surface of the TEC generates approximately 3 degrees Celsius.Since the TEC generates a disproportionate amount of heat for eachdegree of cooling, removing the excess heat from one surface whilecooling an electronic device with an opposing surface can bechallenging. The challenges are particularly acute when testingelectronic devices at extremely low temperatures, as the amount of heatgenerated is a multiple of the heat removed. In some embodiments, usinga single TEC is not sufficient in transferring enough thermal energy tomeet the temperature testing ranges for electronic devices. In otherembodiments, using a single TEC can be sufficient for achieving thedesired thermal testing conditions. In some embodiments, one or moreTECs can be implemented and the number and location of the TECs can bedetermined based on design considerations and desired thermal testingconditions, for example.

In some embodiments, temperature control component 200 includesthermoelectric component (TEC) 202. In embodiments, the TEC, such as TEC202, can serve as a heat pump to deliver heat to or remove heat from asurface. TEC 202 includes two surfaces 204, top surface 204A and bottomsurface 204B. A TEC, such as TEC 202, is configured to concurrentlyincrease the temperature of the top surface (e.g., top surface 204A) anddecrease temperature of the bottom surface (e.g., bottom surface 204B),or concurrently decrease the temperature of the top surface (e.g., topsurface 204A) and increase the temperature of the bottom surface (e.g.,bottom surface 204B) based on a voltage potential applied to the TEC. Insome embodiments, the TEC, such as TEC 202 and TEC 210, includes a setof electrical wires to couple a voltage potential to the TEC and deliverthe requisite current to the TEC. The amount of heat removed ordelivered to a surface can be controlled by the surface area of the TECand/or the power supplied to the TEC. For example, if TEC 210 has twotimes the heat transfer capability of the TEC 202, TEC 210 can have asurface area that is two times the surface area of TEC 202 so that theheat transfer capability of TEC 210 is at least two times that of TEC202. Alternatively, TEC 210 can have a surface area that is similar toTEC 202 but be supplied with twice the power and have twice the heattransfer capability.

In embodiments, temperature control component 200 includes TEC 210. TEC210 can include two surfaces 212, such as top surface 212A and bottomsurface 212B. In embodiments, the bottom surface 212B is coupled to thetop surface 208A of thermal transfer component 206.

In some embodiments, the surface area of TEC 210 and TEC 202 can haveany ratio (e.g., 1:1, 2:1, 1:2, etc.). In some embodiments, TEC 210 hasa larger surface area than TEC 202. In some embodiments, TEC 210 issized to efficiently transfer heat away from TEC 202 under the desiredthermal conditions.

In some embodiments, one or more of TEC 210 or TEC 202 can include oneor more TECs. For example, TEC 202 can include two more TECs that aredistributed above thermal conduction layer 214 and coupled to thermaltransfer component 206. In some embodiments, a single level of TECs canbe implemented. For example, in some embodiments TEC 210 and thermaltransfer component 206 are not implemented and TEC 202 can couple tosurface 222B of heat sink 220. TEC 202 can include any number of TECs atthat particular level.

For purposes of illustration rather than limitation, TEC 202 and TEC 210are illustrated as particular shapes. In some embodiments, one or moreof TEC 210 or TEC 202 can be any shape or size such a round TEC,rectangular TEC, square TEC, and so forth. In some embodiments, theshape of one or more of the selected TECs can be based on the surfaceshape of the electronic devices 250 or the shape of the electronicsystem 252. Electronic devices 250A-250E are generally referred to as“electronic devices 250” herein. For example, if the electronic system252 is shaped as a rectangle with multiple electronic devices aligned ina row, a rectangular-shaped TEC (at least for TEC 202) that is shaped tocouple to the electronic devices 250 of the electronic system 252 canhelp to efficiently transfer thermal energy to and from electronicdevices 250. It can be noted that using TECs with different shapes iswithin the scope of the disclosure.

In some embodiments, temperature control component 200 includes thermaltransfer component 206. In some embodiments, the thermal transfercomponent 206 efficiently conducts thermal energy from a surface of oneTEC to an opposing surface of another TEC. For example, to coolelectronic devices 250 under test, bottom surface 204B of TEC 202removes thermal energy (e.g., heat) from the top surfaces of electronicdevices 250. The top surface 204A of TEC 202 concurrently generatesthermal energy, which is transferred via thermal transfer component 206to the bottom surface 212B of TEC 210. TEC 210 can remove the receivedthermal energy at the bottom surface 212B of the TEC 210. The topsurface 212A of TEC 219 can generated thermal energy, which istransferred to the heat sink 220 and dissipated in the surroundingenvironment.

In some embodiments, the thermal transfer component 206 is composed ormade of a thermally conductive material. Thermally conductive materialsinclude, but are not limited to, copper, aluminum, copper brass, oralloys of the aforementioned materials. It can be noted that otherthermally conductive materials can be used. It can also be noted thatmaterials having a higher thermal conductivity (k) can more efficientlytransfer thermal energy between TEC 202 and TEC 210.

In some embodiments, thermal transfer component 206 includes at leasttwo surfaces 208, including a top surface 208A and a bottom surface208B. The bottom surface 208B of thermal transfer component 206 iscoupled to the top surface 204A of TEC 202. The top surface 208A ofthermal transfer component 206 is coupled to the bottom surface 212B ofTEC 210.

In some embodiments, the thermal transfer component 206 can be coupledto a surface of an adjacent element using a thermal interface material,such as thermally conductive adhesives, thermal greases, phase changematerials, thermal tapes, thermal pads, thermal epoxies, and so forth.For example, a thermal interface material can be disposed between thetop surface 204A of TEC 202 and the bottom surface 208B of thermaltransfer component 206, and between the top surface 208A of thermaltransfer component 206 and the bottom surface 212B of TEC 210. In someembodiments, the thermal interface material can have at least a minimumconductivity of 150 Watts per meter-Kelvin (W/mk) or greater.

In some embodiments, the top surface 208A and bottom surface 208B ofthermal transfer component 206 can have any number of shapes or sizes.In some embodiments, the thermal transfer component 206 is tapered suchthat the top surface 208A and bottom surface 208B align with the surfaceof the adjacent TECs, TEC 210 and TEC 202 respectively. In someembodiments, top surface 208A and bottom surface 208B of thermaltransfer component 206 are sized to match or be close in size to thesurface of the respective TECs. In some embodiments, the top surface208A of the thermal transfer component 206 can be any shape. In someembodiments, the top surface 208A of the thermal transfer component 206can be larger and/or smaller than the surface 212B of TEC 210. Forexample, the top surface 208A of the thermal transfer component 206 canbe larger than the bottom surface 212 of TEC 210 such that none of theedges of TEC 210 extend over any of the edges of the top surface 208A ofthe thermal transfer component 206. In another example, the top surface208A of thermal transfer component 206 can be larger than the bottomsurface 212B of TEC 210 along one axis, but smaller than the bottomsurface 212B of TEC 210 along another axis. For instance, TEC 210 can belonger but narrower than the top surface 208A of thermal transfercomponent 206. In some embodiments, the bottom surface 208B of thethermal transfer component 206 can by any shape. In some embodiments,the bottom surface 208B of the thermal transfer component 206 can belarger and/or smaller than the surface 204A of TEC 202.

In some embodiments, the thermal transfer component 206 can be stepshaped as illustrated. In other embodiments, thermal transfer component206 can have different shapes, such as a flat-sided pyramid that istapered from a top surface to a bottom surface. In some embodiments, theshape of the thermal transfer component 206 can be based in part on theshape of the TEC that contacts a surface of the thermal transfercomponent 206. For example, in implementations that use round TECs theshape of the thermal transfer component 206 can be conical orcylindrical where the bottom surface and the top surface of the thermaltransfer component 206 are round. In some embodiments, the thickness ofthe thermal transfer component 206 (between surface 208A and surface208B) is greater than or equal to the thickness of one of TEC 202 or TEC210.

In some embodiments, the temperature control component 200 can include athermal conduction layer 214. The thermal conduction layer 214 layer caninclude a top surface 216A and a bottom surface 216B. In embodiments,the top surface 216A of the thermal conduction layer 214 is coupled tothe bottom surface 204B of TEC 202. In some embodiments, the thermalconduction layer 214 can transfer thermal energy from the bottom surface204B of TEC 202 to the bottom surface 216B of thermal conduction layer214.

In some embodiments, the bottom surface 216B of thermal conduction layer214 includes planar area 260A and planar area 260B (generally referredto as “planar area 260” herein). Planar area 260 can be positioned aboveone or more electronic devices 250 (e.g., electronic device 250A, 250B,250C, and 250E) of electronic system 252 to transfer thermal energy tothe underlying electronic devices 250. For example, the bottom surface216B of thermal conduction layer 214 can be positioned to couple withthe top surfaces of the packages of the electronic devices 250 of theelectronic system 252 so that the package temperatures of the electronicdevices 250 or the on-chip temperatures of the electronic are controlledto a desired temperature.

In some embodiments, the bottom surface 216B of thermal conduction layer214 can include one or more notched areas, such as notched area 262. Insome embodiments, the notched area 262 can be provided such that the oneor more electronic devices (e.g., electronic device 250D) of theelectronic system 252 directly below the notched area 262 are notcoupled to the thermal conduction layer 214. The notched area 262 canallow an air gap between the underlying electronic device(s) and thethermal conduction layer 214 so that thermal energy is not transferredbetween the thermal conduction layer 214 and the electronic device(s)underlying the notched area 262.

In some embodiments, planar area 260 is intersected by the notched area262. The notched area 262 can include a void in the thermal conductionlayer 214 that extends in a vertical direction from the planar area 260toward the top surface 216A of the thermal conduction layer 214. In someembodiments, the notched area 262 does not vertically intersect thethermal conduction layer 214 from the bottom surface 216B through thetop surface 216A of the thermal conduction layer 214 (e.g., split thethermal conduction layer 214 into two pieces). The notched area 262 canleave some of the thermal conduction layer 214 above the notched areasuch that the thermal conduction layer 214 is a contiguous mass thatefficiently conducts thermal energy.

In some embodiments, the thermal conduction layer 214 includes foursides, such as a front side, back side, first end, and second end. Thenotched area 262 can extend front side to the back side of the thermalconduction layer 214, as illustrated. In some embodiments, the planararea 260 of the bottom surface 216B of the thermal conduction layer 214is intersected by the notched area 262 to form planar area 260A andplanar area 260B. Planar area 260A and planar area 260B can beorientated parallel to a plane and orientated a same vertical distancefrom the plane. In some embodiments, the notched area 262 of the thermalconduction layer 214 is positioned above at least one electronic device250 of the electronic system 252 to insulate the respective electronicdevice(s) 250 (e.g., electronic device 150D) from the transfer ofthermal energy.

In some embodiments, the notched area 262 can be located at any positionalong the bottom surface 216B of the thermal conduction layer 214. Forexample, the notched area 262 can be at an end of the thermal conductionlayer 214. In some embodiments, the notched area 262 can be any size,have any dimensions, and be located at any position with respect to thethermal conduction layer 214. In some embodiments, one or more of thesize, dimensions, and location of the notched area 262 can be determinedbased on the location and size of the underlying electronic device(s)where the transfer of thermal energy is not desired.

In embodiments, the thermal conduction layer 214 can be coupled to TEC202 using a thermal interface material, as described above. Inembodiments, the thermal conduction layer 214 is composed of or madefrom a thermally conductive material, as described above.

In embodiments, the top surface 216A of thermal conduction layer 214 canbe approximately that same size and the same shape as the bottom surface204B of TEC 202. In some embodiments, the size and shape of surfaces 216of thermal conduction layer 214 can be based on the size and shape ofthe top surface (e.g., contact surface) of the electronic devices 250.For example, the thermal conduction layer 214 can be shaped so that thebottom surface 216B couples to most if not all (in some cases, morethan) the top surfaces of electronic devices 250. In some embodiments,the top surface 216A of the thermal conduction layer 214 isapproximately the same size or larger than the bottom surface 204B ofTEC 202. In some embodiments, the bottom surface 216B of the thermalconduction layer 214 can be the same size and shape as the top surface216A of the thermal conduction layer 214. For example, the thermalconduction layer 214 can be a square cube or a rectangular cube. In someembodiments, the thermal conduction layer 214 can be tapered in onedirection or another, e.g., from top surface 216A to bottom surface 216Bor vice versa. It can be noted that that shape of thermal conductionlayer 214 can be based at least in part on the shape of TEC 202, theelectronic devices 250, or the electronic system 252.

In some embodiments, thermal conduction layer 214 can be an optionalelement and TEC 202 can couple with electronic devices 250 to transferthermal energy to and from electronic devices 250.

In some embodiments, the temperature control component 200 can includeone or more thermal sensing devices 218. In some embodiments, thethermal sensing devices 218 can be disposed or embedded within thethermal conduction layer 214. The thermal sensing devices 218 can belocated within thermal conduction layer 214 so that the temperaturesensing surfaces of the thermal sensing devices 218 are in closeproximity to the bottom surface 216B of thermal conduction layer 214. Insome embodiments, one or more thermal sensing devices 218 can bedistributed across the thermal conduction layer 214. Thermal sensingdevices 218 can be used to measure the temperature applied to thepackages of electronic devices 250, which can effectively represent thetemperature at the packages of the electronic devices 250 due to the lowthermal resistance (k) of thermal conduction layer 214. In embodiments,the thermal sensing devices 218 can include any temperature sensingdevices such as a thermocouple, capacitive temperature sensing device,resistive temperature sensing device, and so forth. In embodiments, thethermal sensing devices 218 can include a set of electrical wires tocouple each thermal sensing device 218 to a measurement unit to measurethe output of the thermal sensing device 218.

In some embodiments, the bottom surface 216B of the thermal conductionlayer 214 can include a thermal interface material that is disposedbetween the thermal conduction layer 214 and the underlying electronicdevices 250 of the electronic system 252. In some embodiments, thethermal interface material can be one or more of (e.g.,characteristics), flexible, thermally conductive, compressible,electrically insulating, re-usable, and can return to an original shapeafter compression. An example of interface material having one or moreof the aforementioned characteristics can be a thermal pad. In someembodiments, the vertical heights of the electronic devices 250 of theelectronic system 252 can vary. To couple to the electronic devices 250having varying heights, a thermal pad can be disposed between thethermal conduction layer 214 and electronic devices 250 to compensatefor the varying heights and allow thermal energy to be efficientlytransferred between the thermal conduction layer 214 and the electronicdevices 250. The thermal pad can compress between thermal conductionlayer 215 and the packages of the electronic devices 250 so thatphysical contact is made between the thermal pad and the underlyingelectronic devices 250, which enable thermal coupling between thethermal conduction layer 215 and the electronic devices 250 havingvarying heights.

In some embodiments, the thermal pad 264 can be applied to at least theplanar area 260 of the thermal conduction layer 214. For example,thermal pad 264 includes thermal pad 264A and thermal pad 264B thatcorrespond to the planar area 260A and planar area 260B, respectively.In some embodiments, the thermal pad 264 can include a top surface 266Aand a bottom surface 266B. The top surface 266A of the thermal pad 264can couple (e.g., adhere) to at least the planar area 260 of the bottomsurface 216B of the thermal conduction layer 214.

In some embodiments, the electronic system 252 can have one or moreelectronic devices, as illustrated by electronic devices 250. Theelectronic system 252 is illustrated as a solid-state drive in an M.2form factor. In other embodiments, electronic system 252 can be any typeof electronic system or can be any size. In some embodiments, theelectronic devices are mounted to an electronic circuit board. In someembodiments, one or more of the electronic devices 250 and theelectronic circuit board are included in the electronic system 252. Insome embodiments, the one or more of electronic devices 250 can includeone or more temperature sensing devices, such as an on-chip temperaturesensing device. The on-chip temperature can be different than thepackage temperature of the electronic device 250 due to thermalresistance of the package. Temperature measurements from the on-chiptemperature sensing device, the thermal sensing devices 218 of thethermal conduction layer 214, or both can be used to perform thermaltesting on the electronic devices 250.

In some embodiments, temperature control component 200 can include aheat sink 220. The heat sink 220 can include a top surface 222A and abottom surface 222B. In embodiments, the top surface 222A can include agreater surface area than the bottom surface 222B to help facilitatethermal energy transfer from the heat sink 220 to an adjacent medium. Inembodiments, the bottom surface 222B of heat sink 220 is coupled to thetop surface 212A of TEC 210 to transfer thermal energy from TEC 210 tothe heat sink 220. In some embodiments, the heat sink 220 and TEC 210are coupled using a thermal interface material, as described above. Inembodiments, the heat sink 220 is composed of thermally conductivematerial, as described above.

In some embodiments, the heat sink 220 is a passive mechanical device.In embodiments, the top surface 222A of the heat sink 220 includesmultiple channels and multiple fins disposed on opposing sides of thechannels. In other embodiments, the heat sink 220 can be another type ofheat sink, such a liquid cooled heat sink and so forth.

In some embodiments, heat sink 220 includes one or more attachmentmembers 224. In embodiments, the attachment members can be used tosecure the temperature control component 200 to a thermal chamber. Insome embodiments, the attachment members 224 are configured to receiveadjustable coupling members 226 that can adjustably couple thetemperature control component 200 to a thermal chamber. In someembodiments, the adjustable coupling member can include a spring elementthat allows a vertical position of the temperature control component 200that is mounted to the thermal chamber to be adjusted.

In some embodiments, temperature control component 200 can include afan, such as electric fan 228. In embodiments, the electric fan 228 isdisposed above the top surface 222A of heat sink 220 and used totransfer thermal energy from the heat sink 220 to an adjacent medium,such as the gas medium local the temperature control component 200. Theelectrical fan 228 can include a set of electric wires that coupled to avoltage potential.

A single thermal transfer component 206 is shown for purposes ofillustration, rather than limitation. In other embodiments, multiplethermal transfer components 206 can be used. For example, an additionalthermal transfer component can be stacked on the top surface 212A of TEC210. The additional thermal transfer component can be larger thanthermal transfer component 206. For example, the bottom surface of theadditional thermal transfer component can be approximately the same sizeas the top surface 212A of TEC 210. The additional thermal transfercomponent can be tapered such that the top surface of the additionalthermal transfer component is larger than the bottom surface. Inembodiments, the top surface of the additional thermal transfercomponent can be coupled to a TEC that is larger than (e.g., greatersurface area) TEC 210. Any number of additional thermal transfercomponents or TECs can be implemented in other embodiments.

In FIG. 2C, temperature control component 270 uses a single level ofTECs, such as TEC 272. Thermal conduction layer 274 does not include anynotches. Thermal control component 270 does not implement a second levelof TECs or a thermal transfer component. In FIG. 2D, temperature controlcomponent 280 includes two TECs, such as TEC 282A and TEC 282B, at asingle level. It can be noted that elements of temperature controlcomponent 200, 270, and 280 can be mixed, matched, removed, or added toform different temperature control components.

FIG. 3A-3B illustrates a thermal chamber, in accordance with embodimentsof the disclosure. FIG. 3A illustrates a thermal chamber in a closedposition, in accordance with embodiments of the disclosure. FIG. 3Billustrates a thermal chamber in an open position, in accordance withembodiments of the disclosure. Thermal chamber 300 is described withrelative positional relationships, as shown by three-dimensional (3D)axis 302, for purposes of illustration rather than limitation. It can benoted that assigning other relative positional relationships to thermalchamber 300 is within the scope of the disclosure.

3D axis 302 includes the X-axis, the Y-axis, and the Z-axis. Asillustrated, the X-axis points in the direction of the front and theback with respect to thermal chamber 300. The Y-axis points in thedirection of the two ends with respect to thermal chamber 300. TheY-axis of 3D axis 302 corresponds to horizontal axis 304. The Z-axispoints in the direction of the top and the bottom with respect tothermal chamber 300.

It can be noted that thermal chamber 300 can include one or more hinges,such as hinge 338A and 338B that allows the thermal chamber 300 totransition from an open position to a closed position, and vice versa.FIG. 3A illustrates thermal chamber 300 in a closed position. FIG. 3Billustrates thermal chamber 300 in an open position.

The following describes the positional relationships of the multiplesides of the thermal chamber 300 in the closed position. It can beappreciated that some of the positional relationships of one or more ofthe multiple sides can change by transitioning the thermal chamber 300to another position, such as an open position, which is illustrated inFIG. 3B. In embodiments, thermal chamber 300 includes multiple sides,such a multiple rigid sides. The multiple sides include a back side 308that is orientated parallel to horizontal axis 304, a front side 306that is orientated parallel to the horizontal axis 304, end 310A that isorientated perpendicular to the horizontal axis 304 (e.g., along theX-axis), and end 310B that is orientated perpendicular to horizontalaxis 304 and located opposite the end 310A.

The multiple sides of the thermal chamber 300 also include a top side312 that is orientated perpendicular to the back side 308, front side306, end 310A, and end 310B. The multiple sides of the thermal chamber300 also include a bottom side 314 that is orientated perpendicular tothe back side 308, front side 306, end 310A, and end 310B. Inembodiments, in the closed position the multiple sides form a chamber316 that is enclosed by the multiple sides.

In some embodiments, the thermal chamber 300 is coupled to a frame 348.For example, the bottom side 314 of the thermal chamber 300 can besecured to the frame 348 using one or more fasteners. In someembodiments, frame 348 can be used to with a rack, as illustrated inFIG. 1. Although a single thermal chamber 300 is illustrated as beingsecured to frame 348, in some embodiments one or more thermal chamberscan be secured to a particular frame.

In some embodiments, the top side 312 includes one or more ports 318orientated along a first direction of the horizontal axis 304. It can befurther noted that thermal chamber 300 illustrates a single port 318aligned along the horizontal axis 304, for purposes of illustrationrather than limitation. In other embodiments, thermal chamber 300 caninclude any number of ports 318 located anywhere with respect to thermalchamber 300. In some embodiments, the port 318 include an open area(also referred to as “top side open area 320” herein) that exposes thechamber 316 within the thermal chamber 300. In embodiments, the port 318is configured to receive a temperature control component, such astemperature control component 200 as described with respect to FIG.2A-2D. The temperature control component 200 can be at a position withrespect to the thermal chamber 300 so that the temperature controlcomponent 200 transfers thermal energy to and from the electronicdevices that are exposed the via the chamber 316.

In some embodiments, one or more of the multiple sides are composed of amaterial that is one or more of a thermal insulator, non-conductive, orantistatic material. In some embodiments, that one or more of themultiple sides can be composed of a phenolic material. In someembodiments, the one or more of the multiple sides are composed of aconductive material. In some embodiments, the thermal chamber 300composed of a conductive material can be grounded to a ground potentialto help avoid electrostatic discharge damage at the electronic devicesunder test.

In some embodiments, port 318 includes at least a pair of opposingsides, such as opposing side 322A and opposing side 322B (generallyreferred to as “opposing sides 322” herein) of port 318. In someembodiments, port 318 can be associated with one or more securingfeatures. Securing features allow the temperature control component 200to be secured at the top side 312 of thermal chamber 300 and aligns thetemperature control component 200 to contact the electronic devices thatare exposed in the chamber 316 via the top side open area 312 of thermalchamber 300. For example, securing feature 324A is located adjacent toopposing side 322A of port 318. Securing feature 324B is locatedadjacent to opposing side 322B of port 318. Securing feature 324A and324B (generally referred to as “securing features 324” herein) areassociated with port 318 and allow for a respective temperature controlcomponent 200 to be secured at port 318. In some embodiments, securingfeatures 324 include holes through the top side 312 of the thermalchamber 300. In embodiments, securing features 324 are each configuredto receive an adjustable coupling member to adjustably couple thetemperature control component 200 to the thermal chamber 300 at port318. The number, shape, and locations of the securing features areprovided for purposes of illustration, rather than limitation. In otherembodiments, the number, shape, or location of the securing features canbe different.

Turning to FIG. 3B, in embodiments, the thermal chamber 300 includes agas port 326. The gas port 326 can be configured to allow gas into thechamber 316 of the thermal chamber 300 from an external gas source. Thegas port 326 connects the outer surface of the thermal chamber 300 tothe chamber of the thermal chamber 300. In some embodiments, the gasport 326 includes a hole, such as a circular hole, that is located atone of the multiple sides. For example, the gas port 326 can be locatedat the front side 306, back side 308, end 310A, end 310B, top side 312,or bottom side 314 of the thermal chamber 300. In an illustrativeexample, the gas port 326 is located at the back side 308 of the thermalchamber 300. In some embodiments, the gas port 326 is fitted with a gasfitting 328 that is coupled to the gas port 326. In some embodiments, apart of the gas fitting 328 can be fitted within the gas port 326 andanother part of the gas fitting 328 can extend outside the thermalchamber 300. In some embodiments, the part of the gas fitting 328 thatextends outside the thermal chamber 300 can be coupled to a gas hosethat moves gas from a gas source into the chamber of the thermal chamber300.

In some embodiments, the thermal chamber 300 includes one or moreadjustable standoffs, such as adjustable standoff 344A, adjustablestandoff 344B, adjustable standoff 344C, adjustable standoff 344D,adjustable standoff 344E, and adjustable standoff 344F (generallyreferred to as “adjustable standoff(s) 344” herein). In some embodimentsthe adjustable standoffs 344 can be coupled (e.g., mounted) to thebottom side 314 of the thermal chamber and be positioned perpendicularto the bottom side 314 of the thermal chamber 300. In some embodiments,each of the adjustable standoffs 344 include two ends. A first end iscoupled to the bottom side 314 of the thermal chamber 300 and the secondend is coupled to an electronic circuit board 332 that is located abovethe bottom side 314 of the thermal chamber 300. The adjustable standoffs344 create a vertical distance (e.g., space) between the bottom side 314of the thermal chamber 300 and the electronic circuit board 332. Forexample, adjustable feature 344A includes end 346A that is mounted tothe bottom side 314 of the thermal chamber 300 and end 346B that extendsabove and perpendicular to the bottom side 314.

In some embodiments, one or more of the adjustable standoffs 344 caninclude an adjustable feature, such as adjustable feature 330. Thevertical position of the adjustable feature 330 can be adjusted. Forexample, the adjustable feature 330 can include one or more nuts and theadjustable standoff 344A can include a threaded bolt. The adjustablefeature 330 can be rotated in a counter-clockwise direction to moveupwards or rotated in a clockwise direction to move downwards towardsthe bottom side 314 of the thermal chamber 300. On some embodiments, theelectronic circuit board 332 can be mounted to the adjustable standoffs344 and above the adjustable features of one or more adjustablestandoffs 344. For example, the electronic circuit board 332 can rest onthe adjustable features. The adjustable features can be raised orlowered so that the electronic circuit board 322 can be raised orlowered a similar distance.

In some embodiments, the electronic circuit board 332 can electricallyinterface with the electronic system 252. In some embodiments, theelectronic circuit board 332 is not implemented and the electronicsystem 252 can be coupled within the thermal chamber 300 in a similarmanner as described with respect to electronic circuit board 332.

In some embodiments, electronic circuit board 332 includes four sides, atop surface, and a bottom surface, all of which are contained within thechamber 316 of the thermal chamber 300 in the closed position. Thebottom surface of the electronic circuit board 332 can face the bottomside 314 of the thermal chamber 300.

In some embodiments, an electrical connector 336 is coupled to theelectronic circuit board 332. Electrical connector 336 is configured tocouple the electronic system 252 with the electronic circuit board 332.In some embodiments, electrical connector 336 is above the electroniccircuit board 332. When electronic system 252 is plugged into electricalconnector 336, electronic system 252 is positioned above the electroniccircuit board 332 such that there a vertical space between the topsurface of the electronic circuit board 332 and the bottom surface ofthe electronic system 252.

In some embodiments, a support feature 334 can be located between a topsurface of the electronic circuit board 332 and a bottom surface ofelectronic system 252. In some embodiments, the support feature includesa non-conductive material, such as rubber. In some embodiments, thesupport feature 334 supports the electronic system 252 above theelectronic circuit board 332 at a fixed position. The support feature334 is shown as a pad that is positioned beneath the electronic system252 for purposed of illustration, rather than limitation. In otherembodiments, the support feature can include one or more adjustablestandoffs that are mounted to the electronic circuit board 332.

In some embodiments, an electrical connector 342 is coupled to theelectronic circuit board 332. In some embodiments, electrical connector342 is configured to couple the electronic system 252 to an externalelectronic system (e.g., server 131 of FIG. 1) that is external to thethermal chamber 300.

In some embodiments, at least one of the multiple sides of the thermalchamber 300 can include an electrical connector access port 340. Forexample, electrical connector access port 340 is illustrated at the end310B of the thermal chamber 300. In some embodiments, electricalconnector access port 340 is configured to allow a first end of anelectrical cable to couple to electrical connector 342 and second end ofthe electrical cable to extend through the electrical connector accessport 340 and outside the thermal chamber 300. For example, a ribboncable can be coupled to electrical connector 342. The ribbon cable canextend outside the thermal chamber 300 and couple the electronic system252 (and electronic circuit board 332) to a server, such as server 131of FIG. 1. The server can send and receive signals to and from theelectronic system 252 via the ribbon cable.

In some embodiments, one or more humidity sensors 350 can be locatedwithin the chamber 316 of the thermal chamber 300. The humidity sensor350 can sense humidity level within the chamber 316. For purposes ofillustration, rather than limitation, humidity sensor 350 is illustratedas coupled to electronic circuit board 332. In other embodiments, thehumidity sensor 350 can be located anywhere within the thermal chamber300.

In some embodiments, the thermal chamber 300 can include one or morehinges, such as hinge 338A and hinge 338B (generally referred to as“hinge(s) 338” herein). The one or more hinges can be coupled to any oneor more sides of the multiple sides of the thermal chamber 300. Forexample, hinge 338A is coupled to end 310B and front side 306. Hinges338 are configured to allow the thermal chamber 300 to transitionbetween an open position and a closed position, and vice versa. Thehinges 338 are configured to rotate the top side 312 of the thermalchamber 300 about an axis of rotation. The axis of rotation can beparallel to or perpendicular to the horizontal axis 304.

FIGS. 4A-4B illustrate a system to test electronic devices of anelectronic system under a variety of thermal conditions, in accordancewith embodiments of the disclosure. FIG. 4A illustrates thermal testingsystem 400 in an expanded view, in accordance with embodiments of thedisclosure. FIG. 4B illustrates thermal testing system 400 in acollapsed view, in accordance with embodiments of the disclosure. It canbe noted that a temperature control component, such as temperaturecontrol component 200 of FIGS. 2A-2D, can be used with or be part ofsystem 400. It can also be noted that a thermal chamber, such as thermalchamber 300 of FIG. 3A-3B, can be used with or be part of system 400.Elements of temperature control component 200 of FIGS. 2A-2D and thermalchamber 300 of FIG. 3A-3B are used to help illustrate aspects of FIGS.4A-4B.

System 400 (e.g., also referred to as “thermal testing system 400”herein) can be used to test one or more electronic devices of one ormore electronic systems under a variety of thermal conditions asdescribed herein. In some embodiments, system 400 can include electroniccircuit board 332. The electronic circuit board 332 can be coupled toone or more electronic systems 252 under test. In some embodiments, theelectronic circuit board 332 can facilitate electrical signal transferto and from the one or more electronic devices 250 and to and from anyadditional elements or systems coupled to the electronic circuit board332. In embodiments, the electronic circuit board 332 can facilitatepower transmission to and from the one or more electronic devices 250and to and from any additional elements coupled to the electroniccircuit board 332. For example, one or more humidity sensors can becoupled to the electronic circuit board 332 and the electronic circuitboard 332 can supply power to the one or more humidity sensors. In someembodiments, the electronic circuit board 332 can be coupled to anexternal system, such as a server. The external system via theelectronic circuit board 332 can be used to transmit instructions toperform read operations, write operations, or erase operations at theelectronic devices 250 of the electronic system 252 during theperformance of the thermal test. Furthermore, the external system can beused to retrieve information or test data from the electronic devices250 during the performance of the thermal test.

In some embodiments, the thermal chamber 300 can include one or moreports 318. The one or more ports 318 can expose a chamber within thethermal chamber 300. The electronic system 252 is coupled to anelectrical connector of the electronic circuit board 332. The electronicdevices 250 of the electronic system 252 are accessible from the port318.

In some embodiments, a temperature control component 200 is coupled at atop side of the thermal chamber 300. In some embodiments, port 318 ofthe thermal chamber 300 is configured to receive a temperature controlcomponent 200. In some embodiments, the bottom part of the temperaturecontrol component 200 extends within the chamber of the thermal chamber300 and couples with at least some electronic devices 250 of theelectronic system 252 to transfer thermal energy to and from therespective electronic devices 250. The top part of the temperaturecontrol component 200 extends above the top side of the thermal chamber300.

For example, the top part of the temperature control component 200, suchas a heat sink, can extend above the thermal chamber 300. The bottompart of the temperature control component 200, such as the thermalconduction layer 214 and the thermal pad extend within the thermalchamber. In some embodiments, the thermal pad physically contacts a topsurface of the electronic devices 250. The temperature control component200 can transfer thermal energy to and from the electronic devices 250.For example, temperature control component 200 can change thetemperature of the electronic devices 250 (e.g., package temperature oron-die temperature) in a temperature range from −40 degrees Celsius to140 degrees Celsius.

In some embodiments, the temperature control component 200 can becoupled to the thermal chamber 300. In some embodiments, the thermalchamber 300 can be used to hold the temperature control component 200 inplace. In some embodiments, the thermal chamber 300 can align thetemperature control component 200 with the electronic devices 250 of theelectronic system 252 so that the bottom part of the temperature controlcomponent 200 can couple to the respective electronic devices 250. Inembodiments where the thermal chamber 300 includes multiple ports thathold multiple temperature control components 200, the thermal chamber300 using the adjustable coupling members can allow each of thetemperature control components 200 to apply similar or equal orconsistent pressure to each of the electronic devices of the respectiveelectronic systems. The multiple temperature control components 200 canconcurrently apply different temperatures to the electronic devices ofdifferent electronic systems within the thermal chamber 300.

In some embodiments, the temperature control component 200 can includeattachment members, such as attachment member 224 of FIGS. 2A-2D. Inembodiments, the thermal chamber 300 can include securing features, suchas securing features 324 of FIG. 3A-3B. In some embodiments, theadjustable coupling members can be coupled to the attachment members ofthe temperature control component 200 and the securing features 324 ofthe thermal chamber 300 to adjustably couple the temperature controlcomponent 200 to the thermal chamber 300. In some embodiments, theattachment members and the securing features are configured to receiveadjustable coupling members that can adjustably couple the temperaturecontrol component 200 to the thermal chamber 300. In some embodiments,the adjustable coupling member can include a spring element that allowsa vertical position of the temperature control component 200 that ismounted to the thermal chamber 300 to be adjusted.

In some embodiments, a positive pressure environment within the chamberof thermal chamber 300 is created using gas that is injected within thechamber of the thermal chamber. In some embodiments, rather thanhermetically sealing the thermal chamber 300, the thermal chamber 300(e.g., chamber within the thermal chamber 300) can be maintained as apositive pressure environment so that the only gas going into thethermal chamber 300 is from the gas port, and the only gas escaping thethermal chamber 300 is gas from the gas port. In some embodiments thethermal chamber 300 can include a gas port to receive the gas, such asoil free air (OFA) or nitrogen gas or clean dry air or gas (CDA). Insome embodiments, the gas can have a dew point lower than the expectedcold temperatures range under test. In some embodiments, the gas canhave less than 1 part-per-million (ppm) carbon dioxide and less than0.003 ppm hydrocarbon vapor. The thermal chamber 300 can be used tocontrol the environment proximate to the electronic devices 250 undertest. In embodiments, the gas provided to the thermal chamber 300 has adew point that is lower than the lowest temperature under which theelectronic devices 250 are to be tested. Such a gas is provided to thethermal chamber 300 so that condensate, such as moisture or ice, doesnot form at the electronic devices 250 during test. For example, thepackage of the electronic device under test can be controlled within atemperature range from −25 degrees Celsius to 140 degrees Celsius. Thedew point of the gas can be below −25 degrees Celsius (e.g., −90 degreesCelsius). When a temperature of −25 C is applied to the electronicdevices under test by the temperature control component 200, condensatedoes not form at the electronic devices based on the low dew point ofthe gas provided within the cavity of thermal chamber 300.

In embodiments, rather than changing the temperature of the thermalchamber 300 using hot or cold gas, the temperature control component 200can maintain the temperature environment local to the electronic devices252 under test. In embodiments where the thermal chamber 300 includesmultiple temperature control components 200 coupled to multipleelectronic systems 252, each of the temperature control components 200can be independently controlled and maintain a different (or same)temperature at the electronic devices of respective electronic systemsunder test without using hot or cold gas. For example, first electronicdevices of a first electronic system under test can be coupled to afirst temperature control component. Second electronic devices of asecond electronic system under test can contact a second controlcomponent. Both the first and the second temperature control componentcan be coupled to a single thermal chamber. The first temperaturecontrol component can maintain a temperature at the first electronicdevices at 100 degrees Celsius while the second temperature controlcomponent can maintain a temperature at the second electronic devices at0 degrees Celsius.

FIG. 5 illustrates an example machine of a computer system 500 withinwhich a set of instructions, for causing the machine to perform any oneor more of the methodologies discussed herein, can be executed. In someembodiments, the computer system 500 can correspond to a host or serversystem that includes, is coupled to, or utilizes a test platform (e.g.,to execute operations corresponding to the resource allocator component130 of FIG. 1). In alternative embodiments, the machine can be connected(e.g., networked) to other machines in a LAN, an intranet, an extranet,and/or the Internet. The machine can operate in the capacity of a serveror a client machine in client-server network environment, as a peermachine in a peer-to-peer (or distributed) network environment, or as aserver or a client machine in a cloud computing infrastructure orenvironment.

The machine can be a personal computer (PC), a tablet PC, a set-top box(STB), a Personal Digital Assistant (PDA), a cellular telephone, a webappliance, a server, a network router, a switch or bridge, or anymachine capable of executing a set of instructions (sequential orotherwise) that specify actions to be taken by that machine. Further,while a single machine is illustrated, the term “machine” shall also betaken to include any collection of machines that individually or jointlyexecute a set (or multiple sets) of instructions to perform any one ormore of the methodologies discussed herein.

The example computer system 500 includes a processing device 502, a mainmemory 504 (e.g., read-only memory (ROM), flash memory, dynamic randomaccess memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM(RDRAM), etc.), a static memory 506 (e.g., flash memory, static randomaccess memory (SRAM), etc.), and a data storage system 518, whichcommunicate with each other via a bus 530.

Processing device 502 represents one or more general-purpose processingdevices such as a microprocessor, a central processing unit, or thelike. More particularly, the processing device can be a complexinstruction set computing (CISC) microprocessor, reduced instruction setcomputing (RISC) microprocessor, very long instruction word (VLIW)microprocessor, or a processor implementing other instruction sets, orprocessors implementing a combination of instruction sets. Processingdevice 502 can also be one or more special-purpose processing devicessuch as an application specific integrated circuit (ASIC), a fieldprogrammable gate array (FPGA), a digital signal processor (DSP),network processor, or the like. The processing device 502 is configuredto execute instructions 526 for performing the operations and stepsdiscussed herein. The computer system 500 can further include a networkinterface device 508 to communicate over the network 520.

The data storage system 518 can include a machine-readable storagemedium 524 (also known as a computer-readable medium) on which is storedone or more sets of instructions 526 or software embodying any one ormore of the methodologies or functions described herein. Theinstructions 526 can also reside, completely or at least partially,within the main memory 504 and/or within the processing device 502during execution thereof by the computer system 500, the main memory 504and the processing device 502 also constituting machine-readable storagemedia. The machine-readable storage medium 524, data storage system 518,and/or main memory 504 can correspond to a memory sub-system.

In one embodiment, the instructions 526 include instructions toimplement functionality corresponding to a resource allocator component(e.g., the resource allocator component 130 of FIG. 1). While themachine-readable storage medium 524 is shown in an example embodiment tobe a single medium, the term “machine-readable storage medium” should betaken to include a single medium or multiple media that store the one ormore sets of instructions. The term “machine-readable storage medium”shall also be taken to include any medium that is capable of storing orencoding a set of instructions for execution by the machine and thatcause the machine to perform any one or more of the methodologies of thepresent disclosure. The term “machine-readable storage medium” shallaccordingly be taken to include, but not be limited to, solid-statememories, optical media, and magnetic media.

Some portions of the preceding detailed descriptions have been presentedin terms of algorithms and symbolic representations of operations ondata bits within a computer memory. These algorithmic descriptions andrepresentations are the ways used by those skilled in the dataprocessing arts to most effectively convey the substance of their workto others skilled in the art. An algorithm is here, and generally,conceived to be a self-consistent sequence of operations leading to adesired result. The operations are those requiring physicalmanipulations of physical quantities. Usually, though not necessarily,these quantities take the form of electrical or magnetic signals capableof being stored, combined, compared, and otherwise manipulated. It hasproven convenient at times, principally for reasons of common usage, torefer to these signals as bits, values, elements, symbols, characters,terms, numbers, or the like.

It should be borne in mind, however, that all of these and similar termsare to be associated with the appropriate physical quantities and aremerely convenient labels applied to these quantities. The presentdisclosure can refer to the action and processes of a computer system,or similar electronic computing device, that manipulates and transformsdata represented as physical (electronic) quantities within the computersystem's registers and memories into other data similarly represented asphysical quantities within the computer system memories or registers orother such information storage systems.

The present disclosure also relates to an apparatus for performing theoperations herein. This apparatus can be specially constructed for theintended purposes, or it can include a general purpose computerselectively activated or reconfigured by a computer program stored inthe computer. Such a computer program can be stored in a computerreadable storage medium, such as, but not limited to, any type of diskincluding floppy disks, optical disks, CD-ROMs, and magnetic-opticaldisks, read-only memories (ROMs), random access memories (RAMs), EPROMs,EEPROMs, magnetic or optical cards, or any type of media suitable forstoring electronic instructions, each coupled to a computer system bus.

The algorithms and displays presented herein are not inherently relatedto any particular computer or other apparatus. Various general purposesystems can be used with programs in accordance with the teachingsherein, or it can prove convenient to construct a more specializedapparatus to perform the method. The structure for a variety of thesesystems will appear as set forth in the description below. In addition,the present disclosure is not described with reference to any particularprogramming language. It will be appreciated that a variety ofprogramming languages can be used to implement the teachings of thedisclosure as described herein.

The present disclosure can be provided as a computer program product, orsoftware, that can include a machine-readable medium having storedthereon instructions, which can be used to program a computer system (orother electronic devices) to perform a process according to the presentdisclosure. A machine-readable medium includes any mechanism for storinginformation in a form readable by a machine (e.g., a computer). In someembodiments, a machine-readable (e.g., computer-readable) mediumincludes a machine (e.g., a computer) readable storage medium such as aread only memory (“ROM”), random access memory (“RAM”), magnetic diskstorage media, optical storage media, flash memory components, etc.

The words “example” or “exemplary” are used herein to mean serving as anexample, instance, or illustration. Any aspect or design describedherein as “example’ or “exemplary” is not necessarily to be construed aspreferred or advantageous over other aspects or designs. Rather, use ofthe words “example” or “exemplary” is intended to present concepts in aconcrete fashion. As used in this application, the term “or” is intendedto mean an inclusive “or” rather than an exclusive “or.” That is, unlessspecified otherwise, or clear from context, “X includes A or B” isintended to mean any of the natural inclusive permutations. That is, ifX includes A; X includes B; or X includes both A and B, then “X includesA or B” is satisfied under any of the foregoing instances. In addition,the articles “a” and “an” as used in this application and the appendedclaims may generally be construed to mean “one or more” unless specifiedotherwise or clear from context to be directed to a singular form.Moreover, use of the term “an implementation” or “one implementation” or“an embodiment” or “one embodiment” or the like throughout is notintended to mean the same implementation or implementation unlessdescribed as such. One or more implementations or embodiments describedherein may be combined in a particular implementation or embodiment. Theterms “first,” “second,” “third,” “fourth,” etc. as used herein aremeant as labels to distinguish among different elements and may notnecessarily have an ordinal meaning according to their numericaldesignation.

In the foregoing specification, embodiments of the disclosure have beendescribed with reference to specific example embodiments thereof. Itwill be evident that various modifications can be made thereto withoutdeparting from the broader spirit and scope of embodiments of thedisclosure as set forth in the following claims. The specification anddrawings are, accordingly, to be regarded in an illustrative senserather than a restrictive sense.

What is claimed is:
 1. An apparatus comprising: a first thermoelectriccomponent (TEC) comprising a top surface and a bottom surface, the firstTEC configured to concurrently increase temperature of the top surfaceand decrease temperature of the bottom surface of the first TEC or toconcurrently decrease the temperature of the top surface and increasethe temperature of the bottom surface to transfer thermal energy betweenthe top surface and the bottom surface of the first TEC based on avoltage potential applied to the first TEC; a thermal transfer componentcomprising a top surface and a bottom surface, wherein the top surfaceof the thermal transfer component is coupled to the bottom surface ofthe first TEC; a second TEC comprising a top surface and a bottomsurface, wherein the top surface of the second TEC is coupled to thebottom surface of the thermal transfer component; and a thermalconduction layer comprising a top surface and a bottom surface, whereinthe top surface of the thermal conduction layer is coupled to the bottomsurface of the second TEC, wherein the bottom surface of the thermalconduction layer comprises a planar area, and wherein the planar area ofthe thermal conduction layer is to be positioned above two or moreelectronic devices of a plurality of electronic devices of an electronicsystem to transfer the thermal energy at the two or more electronicdevices.
 2. The apparatus of claim 1, wherein the bottom surface of thethermal conduction layer further comprises a notched area, wherein theplanar area is intersected by the notched area, and wherein the notchedarea comprises a void in the thermal conduction layer that extends in avertical direction from the planar area towards the top surface of thethermal conduction layer.
 3. The apparatus of claim 2, wherein thethermal conduction layer further comprises a front side, a back side, afirst end, and a second end, and wherein the notched area extends fromthe front side to the back side of the thermal conduction layer.
 4. Theapparatus of claim 2, wherein the planar area at the bottom surface ofthe thermal conduction layer is intersected by the notched area to forma first planar area and a second planar area, wherein the first planararea and the second planar area are orientated parallel to a plane andorientated a same vertical distance from the plane.
 5. The apparatus ofclaim 2, wherein the notched area of the thermal conduction layer is tobe positioned above at least one electronic device of the plurality ofelectronic devices to insulate the at least one electronic device fromthe transfer of the thermal energy.
 6. The apparatus of claim 1, furthercomprising: a thermal pad comprising a top surface and a bottom surface,wherein the top surface of the thermal pad to couple to at least theplanar area of the bottom surface of the thermal conduction layer. 7.The apparatus of claim 6, wherein the thermal pad comprises a materialthat is thermally conductive, an electrical insulator, and compressible.8. The apparatus of claim 1, further comprising: a heat sink comprisinga top surface and a bottom surface, wherein the bottom surface of theheat sink is coupled to the top surface of the first TEC to transfer thethermal energy from the first TEC to the heat sink.
 9. The apparatus ofclaim 8, further comprising: a plurality of attachment members of theheat sink, the plurality of attachment members to receive a plurality ofadjustable coupling members to adjustably couple the apparatus to athermal chamber.
 10. The apparatus of claim 8, further comprising: anelectric fan disposed above the top surface of the heat sink to transferthe thermal energy from the heat sink to an adjacent medium.
 11. Asystem to test a plurality of electronic devices under a variety ofthermal conditions, the system comprising: an electronic systemcomprising the plurality of electronic devices; and a temperaturecontrol component to be positioned above two or more electronic devicesof the plurality of electronic devices and to transfer thermal energy atthe two or more electronic devices, the temperature control componentcomprising: a first thermoelectric component (TEC) comprising a topsurface and a bottom surface, the first TEC configured to concurrentlyincrease temperature of the top surface and decrease temperature of thebottom surface of the first TEC or to concurrently decrease thetemperature of the top surface and increase the temperature of thebottom surface to transfer the thermal energy between the top surfaceand the bottom surface of the first TEC based on a voltage potentialapplied to the first TEC; a thermal transfer component comprising a topsurface and a bottom surface, wherein the top surface of the thermaltransfer component is coupled to the bottom surface of the first TEC; asecond TEC comprising a top surface and a bottom surface, wherein thetop surface of the second TEC is coupled to the bottom surface of thethermal transfer component; and a thermal conduction layer comprising atop surface and a bottom surface, wherein the top surface of the thermalconduction layer is coupled to the bottom surface of the second TEC,wherein the bottom surface of the thermal conduction layer comprises aplanar area, and wherein the planar area of the thermal conduction layeris to be positioned above the two or more electronic devices of theplurality of electronic devices to transfer the thermal energy at thetwo or more electronic devices.
 12. The system of claim 11, furthercomprising: a thermal chamber comprising a plurality of sides, wherein aside of the plurality of sides comprises a port that exposes a chamberwithin the thermal chamber, wherein the port is configured to receive abottom part of the temperature control component within the chamber, andwherein a top part of the temperature control component extendsexternally to the thermal chamber.
 13. The system of claim 11, whereinthe bottom surface of the thermal conduction layer further comprises anotched area, wherein the planar area is intersected by the notchedarea, and wherein the notched area comprises a void in the thermalconduction layer that extends in a vertical direction from the planararea towards the top surface of the thermal conduction layer.
 14. Thesystem of claim 13, wherein the thermal conduction layer furthercomprises a front side, a back side, a first end, and a second end, andwherein the notched area extends from the front side to the back side ofthe thermal conduction layer.
 15. The system of claim 13, wherein theplanar area at the bottom surface of the thermal conduction layer isintersected by the notched area to form a first planar area and a secondplanar area, wherein the first planar area and the second planar areaare orientated parallel to a plane and orientated a same verticaldistance from the plane.
 16. The system of claim 13, wherein the notchedarea of the thermal conduction layer is to be positioned above at leastone electronic device of the plurality of electronic devices to insulatethe at least one electronic device from the transfer of the thermalenergy.
 17. The system of claim 13, further comprising: a thermal padcomprising a top surface and a bottom surface, wherein the top surfaceof the thermal pad to couple to at least the planar area of the bottomsurface of the thermal conduction layer.
 18. An apparatus comprising: afirst thermoelectric component (TEC) comprising a top surface and abottom surface, the first TEC configured to concurrently increasetemperature of the top surface and decrease temperature of the bottomsurface of the first TEC or to concurrently decrease the temperature ofthe top surface and increase the temperature of the bottom surface totransfer thermal energy between the top surface and the bottom surfaceof the first TEC based on a voltage potential applied to the first TEC;a thermal transfer component comprising a top surface and a bottomsurface, wherein the top surface of the thermal transfer component iscoupled to the bottom surface of the first TEC; a second TEC comprisinga top surface and a bottom surface, wherein the top surface of thesecond TEC is coupled to the bottom surface of the thermal transfercomponent; and a thermal conduction layer comprising a top surface and abottom surface, wherein the top surface of the thermal conduction layeris coupled to the bottom surface of the second TEC, wherein the bottomsurface of the thermal conduction layer comprises a planar area and anotched area, wherein the planar area is intersected by the notchedarea, and wherein the notched area comprises a void in the thermalconduction layer that extends in a vertical direction from the planararea towards the top surface of the thermal conduction layer.
 19. Theapparatus of claim 18, wherein the thermal conduction layer furthercomprises a front side, a back side, a first end, and a second end,wherein the planar area of the thermal conduction layer is to bepositioned above two or more electronic devices of a plurality ofelectronic devices of an electronic system to transfer the thermalenergy at the two or more electronic devices, wherein the notched areaextends from the front side to the back side of the thermal conductionlayer, wherein the notched area of the thermal conduction layer is to bepositioned above at least one electronic device of the plurality ofelectronic devices to insulate the at least one electronic device fromthe transfer of the thermal energy.
 20. The apparatus of claim 18,further comprising: a thermal pad comprising a top surface and a bottomsurface, wherein the top surface of the thermal pad to couple to atleast the planar area of the bottom surface of the thermal conductionlayer.